Plasma polymerization coating of silica fillers for epoxy molding compounds (EMCs)

Journal of Adhesion Science and Technology

Volumn 17, Issue 3, 2003, Pages 383-396

  Lee, J H ^a   Roh, J H ^a   Yoon, T H ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Acrylic acid; Acrylonitrile; Dimethyl phosphite; Epoxy molding compound; Flexural properties; Plasma polymerization coating

Indexed keywords

ACRYLICS; BENDING STRENGTH; CONTACT ANGLE; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; ORGANIC COATINGS; PHOSPHORUS COMPOUNDS; PLASMA POLYMERIZATION; SILICA; CARBOXYLIC ACIDS; CYANIDES; ELECTRONICS PACKAGING; FILLERS; INTERNET PROTOCOLS; PHENOLS; PLASMAS; PLASTIC COATINGS; POLYMERS; RESINS;

ACRYLIC ACIDS; ACRYLONITRILE; DIMETHYL PHOSPHITE; EPOXY MOULDING COMPOUNDS; FLEXURAL PROPERTIES; PLASMA POLYMERIZATION COATING; SILICA FILLERS;

FILLERS; EPOXY RESINS;

ACRYLIC ACIDS; ACRYLONITRILE; DIMETHYL PHOSPHITE; EPOXY MOLDING COMPOUNDS; FLEXURAL PROPERTIES;

EID: 0037260351     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103762864688     Document Type: Article

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