Effect of plasma polymer deposition methods on copper corrosion protection

Journal of Applied Polymer Science

Volumn 60, Issue 4, 1996, Pages 543-555

  Lin, Y ^a   Yasuda, H ^a  

^a UNIVERSITY OF MISSOURI   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL ATTACK; COPPER CORROSION; CORROSION PROTECTION; DEPOSITION; GLOW DISCHARGES; PITTING; PLASMA APPLICATIONS; POLYMERIZATION; PROTECTIVE COATINGS; SCANNING ELECTRON MICROSCOPY;

ANODE MAGNETRON ENHANCEMENT; DC CATHODIC POLYMERIZATION; MAGNETRON GLOW DISCHARGE POLYMERIZATION; PLASMA POLYMER DEPOSITION; SURFACE DYNAMIC STABILITY; WATER VAPOR PERMEATION RESISTANCE;

POLYMERS;

EID: 0030126098     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19960425)60:4<543::AID-APP8>3.0.CO;2-O     Document Type: Article

References (24)