Physical properties of epoxy molding compound for semiconductor encapsulation according to the coupling treatment process change of silica

Journal of Applied Polymer Science

Volumn 65, Issue 10, 1997, Pages 1975-1982

  Kim, Whan Gun ^a   Ryu, Je Hong ^b  

^a Seokyeong University   (South Korea)

^b Cheil Industries Inc   (South Korea)

Author keywords

Epoxy molding compound; Semiconductor encapsulation; Silane coupling

Indexed keywords

DRYING; ENCAPSULATION; PLASTICS FILLERS; PLASTICS MOLDING; RESIDUAL STRESSES; SEMICONDUCTOR DEVICE MANUFACTURE; SHEET MOLDING COMPOUNDS; SILANES; SILICA; STRENGTH OF MATERIALS;

COUPLING TREATMENT; EPOXY MOLDING COMPOUND; SEMICONDUCTOR ENCAPSULATION;

EPOXY RESINS;

EID: 0031556218     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(sici)1097-4628(19970906)65:10<1975::aid-app15>3.0.co;2-w     Document Type: Article

References (21)

1. W. G. Kim and T. Y. Nam, J. Polym. Sci. Part A Polym. Chem., 34, 957 (1996).
2. W. G. Kim and J. H. Ryu, J. Korean Chem. Soc., 40, 81 (1996).
3. W. G. Kim, J. Y. Lee, and K. Y. Park, J. Polym. Sci. Part A Polym. Chem., 31, 633 (1993).
4. H. Ishida and J. L. Koenig, J. Polym. Sci. Polym. Phys. Ed., 17, 615 (1979).
5. H. Ishida and J. L. Koenig, J. Polym. Sci. Polym. Phys. Ed., 18, 233 (1980).
6. E. G. Chatzi, S. L. Tidrick, and J. L. Koenig, J. Polym. Sci. Part B Polym. Phys., 26, 1585 (1988).
7. J. L. Koenig and H. Emadipour, Polym. Compos., 6, 142 (1985).
8. S. C. Stafford, A. D. Ulrich, and L. A. Canova, Plast. Compound., July/Aug., 41 (1987).
9. PCR Inc., Organofunctional Silane Coupling Agents, PCR Technical Note, 1988.
10. W. G. Kim and T. Y. Nam, U.S. Pat. 5,189,082 (1993); U.S. Pat. 5,428,057 (1995).
11. W. G. Kim, SAITEC, 2, 150 (1989).
12. H. Hozoji, O. Horie, M. Ogata, S. Numata, and N. Kinjo, Kobunshi Ronbunshu, 47, 483 (1990).
13. M. J. Zaini, M. Y. A. Fuad, Z. Ismail, M. S. Mansor, and J. Mustafah, Polym. Int., 40, 51 (1996).
14. M. E. Schrader, J. Adhes., 6, 202 (1970).
15. T. Nakatsuka, H. Kawasaki, K. Itadani, and S. Yamashita, J. Appl. Polym. Sci., 24, 1985 (1979).
16. E. P. Plueddemann and G. L. Stark, in SPI 35th RP / C Institute Proceedings, New Orleans, Feb. 4, 1980.
17. M. Ogata, N. Kinjo, and T. Kawata, J. Appl. Polym. Sci., 48, 583 (1993).
18. T. D. Chang and J. D. Brittain, Polym. Eng. Sci., 18, 1221 (1985).
19. K. P. Pang and J. K. Gillham, J. Appl. Polym. Sci., 37, 1969 (1989).
20. M. Ogata, N. Kinjo, S. Eguchi, H. Hozoji, T. Kawata, and H. Sashima, J. Appl. Polym. Sci., 44, 1795 (1992).
21. L. T. Manzione, Plastic Packaging of Microelectronics Devices, Van Nostrand Reinhold, New York, 1990.