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Journal of Adhesion Science and Technology

Volumn 16, Issue 11, 2002, Pages 1529-1543

Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings

(3) Roh, J H a Lee, J H a Yoon, T H a

a Gwangju Institute of Science and Technology (GIST) (South Korea)

Author keywords

Adhesion; CTE; Epoxy molding compound; Plasma polymer coating; Silica filler

Indexed keywords

ADHESION; BENDING STRENGTH; CURING; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MONOMERS; PLASMA POLYMERIZATION; PLASTIC COATINGS; PLASTIC MOLDS; SCANNING ELECTRON MICROSCOPY; SILICA; WATER ABSORPTION; ELECTRONICS PACKAGING; FUNCTIONAL GROUPS; PHENOLS; PHOSPHORUS COMPOUNDS; PLASMAS; POLYMERS; RESINS; THICKNESS MEASUREMENT;

ALLYL ALCOHOL; ALLYL MERCAPTAN; ALLYLAMINE; DIAMINOPROPANE; EPOXY HEXENE; EPOXY MOLDING COMPOUND; PHENOL NOVOLAC; PYRROLE; TRIPHENYL PHOSPHINE;

SHEET MOLDING COMPOUNDS; PLASTIC COATINGS;

1 ,3-DIAMINOPROPANE; ABSORPTION MEASUREMENTS; ALLYL ALCOHOLS; ALLYL AMINE; AMINE FUNCTIONAL GROUPS; CONTROL SAMPLES; EPOXY MOLDING COMPOUNDS; FRACTURE SURFACES; GAS PRESSURES; HIGHER T; NOVOLAC; PLASMA POLYMER COATING; PLASMA POLYMER COATINGS; PLASMA POWER; RF PLASMA; SILICA FILLER; TREATMENT TIME; TRIPHENYL PHOSPHINES;

EID: 0036334942 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/156856102320252958 Document Type: Article

Times cited : (9)

References (33)

1
- 0004159404
- Van Nostrand Reinhold, New York
- (1990) Plastic Packaging of Microelectronic Devices
- Manzione, L.T.¹

2
- 0004062907
- M. G. Pecht, L. T. Nguyen and E. B. Hakim (Eds); Wiley, New York
- (1995) Plastic-Encapsulated Microelectronics

3
- 0004034858
- CRC Press, Boca Raton, FL
- (1999) Electronic Packaging Materials and Their Properties
- Pecht, M.G.¹ Agarwal, R.² McCluskey, P.³ Javadpour, S.⁴ Mahajan, R.⁵

4
- 0027813193
- (1993) ASME Trans. J. Electronic Packaging , vol.115 , pp. 346-355
- Nguyen, L.T.¹

5
- 0022183127
- (1985) Proc. IEEE Int. Reliability Physics Symp. , pp. 192
- Fukuzawa, I.¹ Ishiguro, S.² Nanbu, S.³

6
- 0002342626
- (1988) Proc. IEEE Int. Reliability Physics Symp. , pp. 82
- Lin, R.¹ Blackshear, E.² Seriky, P.³

7
- 0009945133
- IEEE, New York
- (1991) Proc. 41st Electronic Component Technol. Conf. , pp. 190
- Nishioka, T.¹ Oizumi, S.² Ikemura, K.³ Igarashi, K.⁴

8
- 0009912459
- (1999) J. Microelectronics Packaging Soc. Korea , vol.6 , Issue.3 , pp. 51-63
- Jung, H.Y.¹ Moon, K.S.² Choi, K.S.³ Suh, K.S.⁴ Yoon, H.G.⁵

9
- 0031699928
- (1998) Polym. Polym. Composites , vol.6 , pp. 85-88
- Yamaguchi, M.¹ Nakamura, Y.² Iida, T.³

10
- 0031556218
- (1997) J. Appl. Polym. Sci. , vol.65 , pp. 1975-1982
- Kim, W.G.¹ Ryu, J.H.²

11
- 0025174510
- (1990) Kobunshi Rombunshu , vol.47 , Issue.6 , pp. 483
- Hozoji, H.¹ Horie, O.² Ogata, M.³ Numata, S.⁴ Kinjo, N.⁵

12
- 0029327257
- (1995) IEEE Trans. Component Packaging Manufacturing Technol. Part A , vol.18 , pp. 270-273
- Wong, C.P.¹

13
- 0025790775
- (1991) Polymer , vol.32 , pp. 2221
- Nakamura, Y.¹ Yamaguchi, M.² Kitayama, A.³ Okubo, M.⁴ Matsumoto, T.⁵

14
- 0028396087
- (1994) J. Appl. Polym. Sci. , vol.51 , pp. 1945
- Asai, S.¹ Saruta, U.² Tobita, M.³

15
- 0033329476
- (1999) J. Polym. Sci.: Part A: Polym. Chem. , vol.37 , pp. 3687
- Kaji, M.¹ Nakahara, K.² Ogami, K.³ Endo, T.⁴

16
- 0035255274
- (2001) Eur. Polym. J. , vol.37 , pp. 267-274
- Ho, T.H.¹ Wang, C.S.²

17
- 0025903073
- (1991) J. Adhesion Sci. Technol. , vol.5 , pp. 831
- Pape, P.G.¹ Plueddemann, E.P.²

18
- 0022093193
- (1985) Polym. Composites , vol.6 , pp. 142
- Koenig, J.L.¹ Emadipour, H.²

19
- 0027720660
- (1993) J. Adhesion Sci. Technol. , vol.7 , pp. 1091
- Liston, E.M.¹ Martinu, L.² Wertheimer, M.R.³

20
- 0003621944
- M. Strobel, C. S. Lyons and K. L. Mittal (Eds); VSP, Utrecht
- (1994) Plasma Surface Modification of Polymers: Relevance to Adhesion

21
- 0004201645
- Academic Press, Orlando, FL
- (1985) Plasma Polymerization
- Yasuda, H.¹

22
- 0004011203
- Academic Press, Boston
- (1990) Plasma Processing of Polymers
- D'Agostino, R.¹ Favia, P.² Fracassi, F.³

23
- 0029304975
- (1995) Surface Interface Anal. , vol.23 , pp. 261-275
- Tsai, Y.M.¹ Boerio, F.J.² Van Ooij, W.J.³

24
- 0034963540
- (2001) J. Adhesion Sci. Technol. , vol.15 , pp. 467
- Kang, H.M.¹ Chung, K.H.² Kaang, S.³ Yoon, T.H.⁴

25
- 0017416063
- (1977) J. Polym. Sci., Polym. Chem. Ed. , vol.15 , pp. 81
- Yasuda, H.¹ Hsu, T.²

26
- 0032629563
- (1999) J. Polym. Sci.: Part A: Polym. Chem. , vol.37 , pp. 2191
- Gengenbach, T.R.¹ Griesser, H.J.²

27
- 0026841789
- (1992) J. Appl. Polym. Sci. , vol.44 , pp. 1951
- Barbarossa, V.¹ Contarini, S.² Zanobi, A.³

28
- 0001467023
- (1999) Chem. Mater. , vol.11 , pp. 3252
- Van Os, M.T.¹ Menges, B.² Foerch, R.³ Vancso, G.J.⁴ Knoll, W.⁵

29
- 0031250084
- (1997) Thin Solid Films , vol.307 , pp. 14
- Zhang, J.¹ Wu, M.Z.² Pu, T.S.³ Zhang, Z.Y.⁴ Jin, R.P.⁵ Tong, Z.S.⁶ Zhu, D.Z.⁷ Cao, D.X.⁸ Zhu, F.Y.⁹ Cao, J.Q.¹⁰

30
- 0032673749
- (1999) Thin Solid Films , vol.342 , pp. 119
- Cruz, G.J.¹ Morales, J.² Olayo, R.³

31
- 0000268124
- (1996) Langmuir , vol.12 , pp. 2995
- Rinsch, C.L.¹ Chen, X.² Panchalingam, V.³ Eberhart, R.C.⁴ Wang, J.H.⁵ Timmons, R.B.⁶

32
- 0029774965
- (1996) J. Adhesion Sci. Technol. , vol.10 , pp. 123
- Nihlstrand, A.¹ Hjertberg, T.² Johansson, K.³

33
- 0027583035
- (1993) J. Appl. Polym. Sci. , vol.48 , pp. 583
- Ogata, M.¹ Kinjo, N.² Kawata, T.³

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