The effects of glass beads and silane treatments on the curing behavior of a brominated epoxy resin: DSC analyses

Journal of Polymer Science, Part B: Polymer Physics

Volumn 35, Issue 13, 1997, Pages 2063-2071

  Hong, S G ^a   Lin, J J ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

Brominated epoxy resin; Curing kinetics; Dicyandiamide; Glass bead; Silanes

Indexed keywords

ACTIVATION ENERGY; BROMINE COMPOUNDS; CHEMICAL ACTIVATION; COMPOSITION EFFECTS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GLASS; GLASS TRANSITION; REACTION KINETICS; SILANES; THERMAL EFFECTS;

DICYANDIAMIDE;

EPOXY RESINS;

EID: 0031233792     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-0488(19970930)35:13<2063::AID-POLB7>3.0.CO;2-X     Document Type: Article

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