High-performance packaging of power electronics

MRS Bulletin

Volumn 28, Issue 1, 2003, Pages 41-50

  Shaw, M C ^a  

^a CALIFORNIA LUTHERAN UNIVERSITY   (United States)

Author keywords

Fracture; Layered structures; Microelectronics packaging and integration; Structural materials

Indexed keywords

ELECTRIC ENERGY STORAGE; FRACTURE; INTEGRATED CIRCUIT LAYOUT; MICROELECTRONICS; MICROSTRUCTURE; POWER AMPLIFIERS; POWER CONVERTERS; POWER ELECTRONICS; SEMICONDUCTOR MATERIALS; SOLDERING ALLOYS; SOLID STATE DEVICES; VARIABLE SPEED DRIVES;

LAYERED STRUCTURES; MICROELECTRONICS INTEGRATION; MICROELECTRONICS PACKAGING;

ELECTRONICS PACKAGING;

EID: 0037249521     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2003.16     Document Type: Article

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