Qualitative modeling of silica plasma etching using neural network

Journal of Applied Physics

Volumn 93, Issue 1, 2003, Pages 76-82

  Kim, Byungwhan ^a   Kwon, Kwang Ho ^b  

^a Sejong University   (South Korea)

^b Hanseo University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BACKPROPAGATION; PLASMA DENSITY; PLASMA ETCHING; SILICA; THIN FILMS;

GAS FLOW;

NEURAL NETWORKS;

EID: 0037248690     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1527216     Document Type: Article

References (17)

1. M. Takahashi and N. Koshida, J. Appl. Phys. 86, 5274 (1999).
2. Y. C. Yah, A. J. Faber, H. De Waai, P. G. Kik, and A. Polman, Appl. Phys. Lett. 71, 2922 (1997).
3. A. Massimi, E. D. Fabrizio, M. Gentili, D. Piccinin, and M. Martinelli, Jpn. J. Appl. Phys., Part 1 38, 6150 (1999).
4. A. Miliou, H. Zhenguang, H. C. Cheng, R. Srivastava, and R. V. Ramaswamy, IEEE J. Quantum Electron. 25, 1889 (1989).
5. M. V. Bazylenko and M. Gross, J. Vac. Sci. Technol. A 14, 2994 (1996).
6. B. Kim, K. H. Kwon, and S. H. Park, J. Vac. Sci. Technol. A 17, 2593 (1999).
7. D. E. Rummelhart and J. L. McClelland, Parallel Distributed Processing (MIT Press, Cambridge, MA, 1986).
8. D. C. Mongomery, Design and Analysis of Experiments (Wiley, New York, 1991).
9. B. Kim and G. S. May, IEEE Trans. Semicond. Manuf. 7, 12 (1994).
10. B. Kim and S. Park, Chemom. Intell. Lab. Syst. 56, 39 (2001).
11. S. Xu, Z. Sun, A. Chen, X. Qian, and D. Podlesnik, J. Vac. Sci. Technol. A 19, 871 (2001).
12. C. Steinbruchel, Appl. Phys. Lett. 55, 1960 (1989).
13. N. R. Rueger, J. J. Bculens, M. Schaepkens, M. F. Doemling, J. M. Mirza, T. E. F. M. Standaert, and G. S. Oehrlein, J. Vac. Sci. Technol. A 15, 1881 (1997).
14. Y. Horiike, K. Kubota, H. Shindo, and T. Fukawawa, J. Vac. Sci. Technol. A 13, 801 (1995).
15. H. Sugai, K. Nakamura, Y. Hikosaka, and M. Nakamura, J. Vac. Sci. Technol. A 13, 887 (1995).
16. K. Takahashi, M. Hori, and T. Goto, J. Vac. Sci. Technol. A 14, 2004 (1996).
17. M. J. Sowa, M. E. Littau, V. Pohray, and J. L. Cecchi, J. Vac. Sci. Technol. A 18, 2122 (2000).