Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation

Journal of Electronic Materials

Volumn 32, Issue 1, 2003, Pages 9-17

  Fong, H P ^a   Wu, Y ^a   Wang, Y Y ^a   Wan, C C ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Colloid; Cu; Electroless; Pd; ULSI

Indexed keywords

COLLOIDS; COPPER; DEPOSITION; TITANIUM NITRIDE;

COLLOID ACTIVATION;

ULSI CIRCUITS;

EID: 0037237023     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0246-4     Document Type: Article

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