A search for the mechanism of direct copper plating via bridging ligands

Journal of the Electrochemical Society

Volumn 143, Issue 11, 1996, Pages 3521-3525

  Yang, C H ^a   Wang, Y Y ^a   Wan, C C ^a   Chen, C J ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b Persee Chemical Company   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COPPER PLATING; ELECTRON SPECTROSCOPY; REACTION KINETICS; SPECTROSCOPIC ANALYSIS;

BRIDGING LIGANDS; PALLADIUM SULFIDE; POTASSIUM IODIDE; SODIUM CYANIDE; SODIUM THIOCYANATE; THIOUREA;

ELECTROLESS PLATING;

EID: 0030285752     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837247     Document Type: Article

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