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Volumn 13, Issue 1, 2003, Pages 134-140

Design, realization and testing of micro-mechanical resonators in thick-film silicon technology with postprocess electrode-to-resonator gap reduction

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRODES; ETCHING; NATURAL FREQUENCIES; RESONATORS; TRANSDUCERS;

EID: 0037231433     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/13/1/319     Document Type: Article
Times cited : (33)

References (10)
  • 1
    • 0035008072 scopus 로고    scopus 로고
    • A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators
    • (Jan. 2001)
    • Hsu W-T, Clark J R and Nguyen C T-C 2001 A sub-micron capacitive gap process for multiple-metal-electrode lateral micromechanical resonators Proc. MEMS'01 (Jan. 2001) pp 349-52
    • (2001) Proc. MEMS'01 , pp. 349-352
    • Hsu, W.-T.1    Clark, J.R.2    Nguyen, C.T.-C.3
  • 5
    • 0002417539 scopus 로고
    • Electrostatically driven vacuum-encapsulated polysilicon resonators
    • Parts 1 and 2
    • Legtenberg R and Tihnans H A C 1994 Electrostatically driven vacuum-encapsulated polysilicon resonators, Parts 1 and 2 Sensors Actuators A 45 57-84
    • (1994) Sensors Actuators A , vol.45 , pp. 57-84
    • Legtenberg, R.1    Tihnans, H.A.C.2
  • 6
    • 0024769661 scopus 로고
    • Laterally driven polysilicon resonant microstructures
    • Tang W C, Nguyen T-C H and Howe R T 1989 laterally driven polysilicon resonant microstructures Sensors Actuators 20 25-32
    • (1989) Sensors Actuators , vol.20 , pp. 25-32
    • Tang, W.C.1    Nguyen, T.-C.H.2    Howe, R.T.3
  • 8
    • 0036124053 scopus 로고    scopus 로고
    • High-frequency high-Q micromechanical resonator in thick epipoly technology with post-process gap adjustment
    • (USA: IEEE)
    • Galayko D, Kaiser A, Legrand B, Collard D, Buchaillot L and Combi C High-frequency high-Q micromechanical resonator in thick epipoly technology with post-process gap adjustment Proc. MEMS2002 (USA: IEEE)
    • Proc. MEMS2002
    • Galayko, D.1    Kaiser, A.2    Legrand, B.3    Collard, D.4    Buchaillot, L.5    Combi, C.6
  • 9
    • 0032071105 scopus 로고    scopus 로고
    • Dry etching of deep SI trenchesz for released resonatours in a Cl2 plasma
    • Weigold J W, Juan W H and Pang S W 1998 Dry etching of deep SI trenchesz for released resonatours in a Cl2 plasma J. Electrochem. Soc. 145 1767-71
    • (1998) J. Electrochem. Soc. , vol.145 , pp. 1767-1771
    • Weigold, J.W.1    Juan, W.H.2    Pang, S.W.3
  • 10
    • 0030206394 scopus 로고    scopus 로고
    • Polysilicon integrated microsystems: Technologies and application
    • Howe R T, Boser B E and Pisano A P 1996 Polysilicon integrated microsystems: Technologies and application Sensors Actuators A 56 167-77
    • (1996) Sensors Actuators A , vol.56 , pp. 167-177
    • Howe, R.T.1    Boser, B.E.2    Pisano, A.P.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.