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Journal of Applied Physics

Volumn 92, Issue 2, 2002, Pages 987-991

Microstructure evolution and failure mechanism for Cu/Au Schottky contacts to InGaP layer

(2) Liu, Day Shan a Lee, Ching Ting a

a NATIONAL CENTRAL UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING TEMPERATURES; CROSS-SECTIONAL STRUCTURES; DIFFRACTION PEAKS; DIFFUSION CONSTANT; FAILURE MECHANISM; MICROSTRUCTURE EVOLUTIONS; MIXED STRUCTURE; SCHOTTKY CONTACTS; THERMAL-ANNEALING; TRANSMISSION ELECTRON MICROSCOPY TEM; XRD MEASUREMENTS;

ACTIVATION ENERGY; RAPID THERMAL ANNEALING; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

MICROSTRUCTURE;

EID: 0037100992 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1487439 Document Type: Article

Times cited : (5)

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