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Volumn 14, Issue 13, 2002, Pages 3565-3574
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The role of H in the Cu+ drift diffusion in plasma-deposited a-SiC:H
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
COPPER;
DEPOSITION;
ETCHING;
HYDROGEN;
PLASMA APPLICATIONS;
SILICON CARBIDE;
THERMODYNAMIC STABILITY;
AGGRESSIVE ETCHING;
COPPER DRIFT DIFFUSION;
PLASMA DEPOSITED FILM;
WET CHEMICAL;
DIFFUSION;
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EID: 0037041142
PISSN: 09538984
EISSN: None
Source Type: Journal
DOI: 10.1088/0953-8984/14/13/314 Document Type: Article |
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Times cited : (10)
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References (14)
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