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Volumn 37-38, Issue , 1997, Pages 205-210

Investigation of copper diffusion in SiOF, TEOS oxide and TCA oxide using bias thermal stress (BTS) tests

Author keywords

BTS; Copper; Humidity; Low dielectric; PECVD; SiOF

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; COPPER; DIELECTRIC MATERIALS; METALLIZING; SEMICONDUCTING SILICON COMPOUNDS; STRESS ANALYSIS; THERMAL STRESS;

EID: 18744436911     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00113-5     Document Type: Article
Times cited : (7)

References (6)
  • 1
    • 0040298153 scopus 로고    scopus 로고
    • Fluorine stability in fluorosilicate glass and effect on dielectric properties
    • February
    • G. Passemard, P. Fugier, P. Noel, F. Pieres and O. Demolliens, Fluorine stability in fluorosilicate glass and effect on dielectric properties, in: DUMIC Conf. (February 1996) p. 145.
    • (1996) DUMIC Conf. , pp. 145
    • Passemard, G.1    Fugier, P.2    Noel, P.3    Pieres, F.4    Demolliens, O.5
  • 4
    • 0010328598 scopus 로고
    • Sub-half micron interconnects using reflow of sputtered copper films
    • June
    • K. Abe, Y. Harada and H. Onoda, Sub-half micron interconnects using reflow of sputtered copper films, in: VMIC Conf. (June 1995) p. 308.
    • (1995) VMIC Conf. , pp. 308
    • Abe, K.1    Harada, Y.2    Onoda, H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.