![]() |
Volumn 37-38, Issue , 1997, Pages 205-210
|
Investigation of copper diffusion in SiOF, TEOS oxide and TCA oxide using bias thermal stress (BTS) tests
|
Author keywords
BTS; Copper; Humidity; Low dielectric; PECVD; SiOF
|
Indexed keywords
ANNEALING;
CHEMICAL VAPOR DEPOSITION;
COPPER;
DIELECTRIC MATERIALS;
METALLIZING;
SEMICONDUCTING SILICON COMPOUNDS;
STRESS ANALYSIS;
THERMAL STRESS;
BIAS THERMAL STRESS (BTS) TESTS;
MEAN TIME TO FAILURE (MTTF);
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);
INTEGRATED CIRCUIT MANUFACTURE;
|
EID: 18744436911
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/S0167-9317(97)00113-5 Document Type: Article |
Times cited : (7)
|
References (6)
|