Quasi-static parameters, low-frequency solutions, and full-wave solutions of a single-layered via

Microwave and Optical Technology Letters

Volumn 35, Issue 1, 2002, Pages 34-40

  Li, Qin ^a   Tsang, Leung ^b   Chen, Houfei ^a  

^a University of Washington   (United States)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Scattering parameter; Via discontinuity

Indexed keywords

FREQUENCY DOMAIN ANALYSIS; GREEN'S FUNCTION; NATURAL FREQUENCIES; PARAMETER ESTIMATION; WAVEFORM ANALYSIS; WAVEGUIDES;

FULL WAVE SOLUTION; LOW FREQUENCY SOLUTION; PARALLEL GROUND PLANES; QUASI-STATIC PARAMETERS; SCATTERING PARAMETER;

ELECTROMAGNETIC WAVE SCATTERING;

EID: 0037026971     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.10508     Document Type: Article

References (16)

1. A.E. Ruehli, Equivalent circuit models for three-dimensional multi-conductor systems, IEEE Trans Microwave Theory Tech MTT-22 (1974), 216-221.
2. A. Djordjevic and T.K. Sarkar, Computation of inductance of simple vias between two striplines above a ground plane, IEEE Trans Microwave Theory Tech MTT-33 (1985), 268-269.
3. T. Wang, R. F. Harrington, and J.R. Mautz, Quasi-static analysis of a microstrip via through a hole in a ground plane, IEEE Trans Microwave Theory Tech MTT-36 (1988), 1008-1013.
4. P. Kok and D.D. Zutter, Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines, IEEE Trans Microwave Theory Tech 42 (1994), 2270-2276.
5. P. Kok and D.D. Zutter, Capacitance of a circular symmetric model of a via hole including finite ground plane thickness, IEEE Trans Microwave Theory Tech 39 (1991), 1229-1234.
6. A.W. Mathis, A.F. Peterson, and C.M. Butler, Rigorous and simplified models for the capacitance of a circularly symmetric via, IEEE Trans Microwave Theory Tech MTT-45 (1997), 1875-1878.
7. S.G. Hsu and R.B. Wu, Full wave characterization of a through hole via using the matrix-penciled moment method, IEEE Trans Microwave Theory Tech 42 (1994), 1540-1547.
8. J.P. Quine, H.F. Webster, H.H. Glascock, and R.O. Carlson, Characterization of via connections in silicon circuit boards, IEEE Trans Microwave Theory Tech MTT-36 (1988), 21-27.
9. Q. Gu, Y.E. Yang, and M.A. Tassoudji, Modeling and analysis of vias in multilayered integrated circuits, IEEE Trans Microwave Theory Tech MTT-41, 206-214.
10. H.F. Chen, L. Tsang, Q. Li, C.C. Huang, and V. Jandhyala, Analysis of via discontinuity in multi-layered structure, IEEE Trans Microwave Theory Tech, in press.
11. Q. Gu, A. Tassoudji, S.Y. Poh, R.T. Shin, and J.A. Kong, Coupled noise analysis for adjacent vias in multilayered digital circuits, IEEE Trans Circuits Syst 41 (1994), 796-804.
12. L. Tsang, H. Chen, C.C. Huang, and V. Jandhyala, Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations, Microwave Opt Technol Lett 31 (2001), 201-208.
13. L. Tsang, H.F. Chen, Q. Li, and V. Jandhyala, Coupling of a large number of vias in electronic packaging structures, IEEE Trans Microwave Theory Tech, in press.
14. C.C. Huang, L. Tsang, D. Miller, A. Arabi, and A. Tripathi, Modeling of multi-vias coupling for high speed interconnect, EPEP 2001.
15. C.C. Huang, L. Tsang, and C.H. Chan, Multiple scattering among vias in lossy planar waveguides using SMCG method, IEEE Trans Adv Packaging, in press.
16. J.R. Reitz, F.J. Milford, and R.W. Christy, Foundations of electromagnetic theory (3rd ed.), Addison-Wesley, Reading, MA, 1980.