A new ultra-low K ILD material based on organic-inorganic hybrid resins

Materials Research Society Symposium - Proceedings

Volumn 716, Issue , 2002, Pages 575-580

  Zhong, Ben ^a   Meynen, Herman ^b   Iocopi, Francesca ^c,d   Weidner, Ken ^a   Mailhouitre, Stephane ^c,d   Moyer, Eric ^a   Bargeron, Cory ^a   Schalk, Paul ^a   Peck, Alan ^a   Van Hove, Marleen ^c   Maex, Karen ^c,d  

^a DOW CORNING CORPORATION   (United States)

^b Dow Corning SA Belgium   (Belgium)

^c IMEC   (Belgium)

^d UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; CRACKS; CURING; ELECTRIC BREAKDOWN; INORGANIC POLYMERS; ORGANIC POLYMERS; PERMITTIVITY; PHASE SEPARATION; PORE SIZE; POSITRON ANNIHILATION SPECTROSCOPY; SPIN COATING; THERMAL EFFECTS;

COHESIVE STRENGTH; CRACK RESISTANCE; ELLIPSOMETRIC POROSIMETRY; HYBRID RESINS; POROGEN GROUPS;

RESINS;

EID: 0036955703     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-716-b12.4     Document Type: Conference Paper

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