Liquid immersion lens technology applied to laser voltage probing of 130 nm process technology devices

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 6, 2002, Pages 3067-3070

  Nataraj, Nagamani ^a   Deslandes, Herve ^a   Lo, William ^a   Eiles, Travis ^b   Pardy, Patrick ^b  

^a NPTest   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION; ELECTROOPTICAL EFFECTS; FLIP CHIP DEVICES; IMAGING TECHNIQUES; INTEGRATED CIRCUITS; LASER MODE LOCKING; LIGHT TRANSMISSION; MICROSCOPIC EXAMINATION; OPTICAL INSTRUMENT LENSES; PROBES; REFRACTIVE INDEX; SEMICONDUCTING SILICON;

DIFFRACTION-LIMITED RESOLUTION; LASER VOLTAGE PROBING; LIQUID IMMERSION LENS TECHNOLOGY; NEAR-INFRARED LASER; NUMERICAL APERTURE; PHOTO-SENSITIVE DETECTION;

PULSED LASER APPLICATIONS;

EID: 0036883206     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1523406     Document Type: Article

References (15)

1. M. Paniccia, R. M. Rao, and Y. M. Yee, J. Vac. Sci. Technol. B 16, 3625 (1998).
2. T. M. Eiles, G. L. Woods, and V. R. Rao, Proceedings of the International Solid State Circuits Conference (ISSCC), 2000, p. 220.
3. Hamamatsu A3717, 100×NIR objective lens. Currently discontinued.
4. W. J. Smith, Modern Optical Engineering, 3rd ed. (SPIE Press McGraw-Hill, New York, 2000), p. 160.
5. Zeiss Plan Apochromat: www.zeiss.com
6. S. B. Ippolito, B. B. Goldberg, and M. S. Unlu, Appl. Phys. Lett. 78, 4071 (2001).
7. M. Baba, T. Sasaki, M. Yoshita, and H. Akiyama, J. Appl. Phys. 85, 6923 (1999).
8. T. M. Eiles, D. Hunt, and D. Chi, Proceedings of the International Symposium for Testing and Failure Analysis, 2000, p. 547.
9. T. M. Eiles and P. Pardy, Proceedings of the 27th International Symposium for Testing and Failure Analysis, 2001, p. 167.
10. K. R. Wilsher and W. K. Lo, Proceedings of ITC, 1999, p. 932.
11. T. M. Eiles, K. R. Wilsher, W. K. Lo, and G. Xiao, Proceedings of ITC, 2000, p. 80.
12. K. R. Wilsher, W. K. Lo, T. M. Eiles, and G. Xiao, Proceedings of the International Symposium for Testing and Failure Analysis, 2000, p. 479.
13. Schlumberger Technologies Test Chip "Azuma," a 0.18 μ CMOS flip chip, substrate thickness 50 μm, optical surface finish.
14. J. A. Block, W. K. Lo, and C. R. Shaw, Proceedings of the 10th Asian Test Symposium, 2001, p. 185.
15. W. Lo, S. Kasapi, and K. Wilsher, IEEE LEOS Newsletter 15, 3 (2001); (http://www.ieee.org/organizations/pubs/newsletters/leos/dec01/index.html)