Liquid Immersion Objective for High-Resolution Optical Probing of Advanced Microprocessors

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2001, Pages 167-170

  Eiles, Travis ^a   Pardy, Patrick ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTI-REFLECTION COATINGS; OPTICAL PROBING;

MICROSCOPIC EXAMINATION; OPTIMIZATION; PHOTOLITHOGRAPHY; PHOTONS; SILICON; TRANSISTORS; WAVEFORM ANALYSIS;

MICROPROCESSOR CHIPS;

EID: 1542330661     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. S. Tyagi, et al, "A 130 nm Generation Logic Technology. . .," International Electron Devices Meeting Technical Digest, 567-570, 2000.
2. International Technology Roadmap for Semiconductors; Lithography (1999); see http://public.itrs.net/files/1999_SIA_Roadmap/Home.htm, referenced on July 31, 2001.
3. T.M. Eiles, G.L. Woods, V.R. Rao, "Optical Probing of Flip-Chip-Packaged Microprocessors," Proceedings of the International Solid State Circuits Conference (ISSCC), p. 220 (2000).
4. S.M. Mansfield and G.S. Kino, "Solid Immersion Microscope," Appl. Phys. Lett. 57, 2615-2616 (1990).
5. T. Eiles, D. Hunt, and D. Chi, "Transparent Heat Spreader for Backside Optical Analysis of High Power Microprocessors," International Symposium on Test and Failure Analysis (ISTFA), 2000
6. See www.nyeoptical.com, referenced on July 31, 2001.
7. W.J. Smith, Modern Lens Design, p. 257, McGraw-Hill, New York, 1992.