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Volumn 17, Issue 9, 2002, Pages 978-982

Additive vapour effect on the conformal coverage of a high aspect ratio trench using MOCVD copper metallization from (hfac)Cu(DMB) precursor

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; ASPECT RATIO; METALLIC FILMS; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; MORPHOLOGY; SILICON WAFERS; SUBSTRATES;

EID: 0036714064     PISSN: 02681242     EISSN: None     Source Type: Journal    
DOI: 10.1088/0268-1242/17/9/314     Document Type: Article
Times cited : (9)

References (15)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.