Analysis of the bounces on the power/ground plane structures by planar circuit model and APA-E algorithm

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 2, 2001, Pages 184-190

  Yang, Xiaoping ^b   Li, Zhengfan ^b   Mao, Junfa ^a,b  

^a IEEE

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

APA E algorithm; Planar circuit model; Power ground bounces; Power ground plane structures

Indexed keywords

ALGORITHMS; DIGITAL INTEGRATED CIRCUITS; EXTRAPOLATION; FINITE DIFFERENCE METHOD; GATES (TRANSISTOR); MULTICHIP MODULES; TIME DOMAIN ANALYSIS;

FINITE DIFFERENCE TIME DOMAIN (FDTD) METHODS;

PRINTED CIRCUIT BOARDS;

EID: 0035329030     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.928753     Document Type: Article

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