The Microstructure and Shear Strength of the BGA Joint Using Cu Cored Sn-3. 5Ag Solder

journal of the japan institute of Electronics Packaging

Volumn 4, Issue 3, 2001, Pages 192-199

  Kohara, Yasuhiro ^a   Saeki, Toshio ^a   Uenishi, Keisuke ^a   Kobayashi, Kojiro K ^a   Shohii, Ikuo ^b   Yamamoto, Masaharu ^c  

^a OSAKA UNIVERSITY   (Japan)

^b GUNMA UNIVERSITY   (Japan)

^c HITACHI CABLE LTD   (Japan)

Author keywords

Ball Grid Allay; Cu Core; Pb Free Solder; Shear Strength; Sn Ag

Indexed keywords

EID: 85009539105     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.4.192     Document Type: Article

References (7)

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