Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint Using Electroless Plated Ni/Au Pad

journal of the japan institute of Electronics Packaging

Volumn 4, Issue 4, 2006, Pages 306-311

  Saeki, Toshio ^a   Kiyono, Shinya ^a   Uenishi, Keisuke ^a   Kobayashi, Kojiro F ^a   Shohji, Ikuo ^b   Yamamoto, Masaharu ^c  

^a OSAKA UNIVERSITY   (Japan)

^b GUNMA UNIVERSITY   (Japan)

^c HITACHI CABLE LTD   (Japan)

Author keywords

Ball Grid Array; Cu Cored Ball; Electroless Plating; Reaction Layer; Shear Strength

Indexed keywords

EID: 85009548587     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.4.306     Document Type: Article

References (5)

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5. Kwang-Lung Lin and Jieh-Ting Chang:“The Elemental Interaction in the Electrodeposited Pb-Sn/Electroless Ni-P Deposit Al Multilayer upon Heat Treatment”, Scripta Metallugica Et Materialia, Vol. 30, No. 5, pp. 559-564, 1994.