Modeling the thermal response of semiconductor devices through equivalent electrical networks

IEEE Transactions on Circuits and Systems I: Fundamental Theory and Applications

Volumn 49, Issue 8, 2002, Pages 1187-1197

  Codecasa, Lorenzo ^a   D'Amore, Dario ^a   Maffezzoni, Paolo ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

Circuit modeling; Electrothermal analysis; Thermal instability

Indexed keywords

BIPOLAR TRANSISTORS; MOSFET DEVICES; OSCILLATORS (ELECTRONIC); TERMINALS (ELECTRIC); THERMODYNAMIC STABILITY;

THERMAL IMPEDANCE;

ELECTRIC NETWORK ANALYSIS;

EID: 0036688673     PISSN: 10577122     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCSI.2002.801279     Document Type: Article

References (20)

1. Accurate algorithm for temperature calculation in nonlinear circuit analysis
2. Computer simulation of integrated circuits in the presence of electrothermal interaction
3. Simulating the dynamic electrothermal behavior of power electronic circuits and systems
4. Electrothermal simulation of integrated circuits
5. Fully coupled dynamic electrothermal simulation
6. Combined electrical and thermal circuit simulation using APLAC. Part C: Thermal spreading impedance models
7. Self-consistent electro-thermal simulation: A realization by simultaneous iteration
8. A rational formulation of thermal circuit models for electrothermal simulation - Part I: Finite element method
9. A rational formulation of thermal circuit models for electrothermal simulation - Part II: Model reduction techniques
10. A new approach to model self-heating in electric circuits through thermal networks
11. Electro-thermal resonance in MOSFET devices
12. Exploiting electro-thermal resonance in high voltage power bipolar devices
13. Analysis of fast electrothermal dynamics in power BJT
14. Internal thermal feedback in four-poles especially in transistors
15. On the representation of infinite-length distributed RC one-ports
16. Identification of RC networks by deconvolution: Chances and limits
17. Impact of self-heating and thermal coupling on analog circuits in SOI CMOS
18. Temperature dependent RF large signal model incorporating self heating effects