Incorporation of inorganic filler into the no-flow underfill material for flip-chip application

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 303-310

  Fan, Lianhua ^a   Shi, Songhua ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MELTING; SOLDERED JOINTS; SOLDERING ALLOYS; THERMAL EXPANSION; WETTING;

NO-FLOW UNDERFILL;

ELECTRONICS PACKAGING;

EID: 0033698484     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)