Methodology for screening high performance underfill materials

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 111-116

  Hoang, L ^a   Murphy, A ^a   Desai, K ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

TESTING; FLOW OF FLUIDS; MATERIALS TESTING; MOISTURE; RELIABILITY; SHEAR STRENGTH; THERMAL EFFECTS;

FLOW STUDIES; GOOD CORRELATIONS; PROCESS WINDOW; PROCESSABILITY; ROBUST MATERIALS; SHEAR TESTS; SOAKING CONDITIONS; UNDERFILL MATERIALS;

NETWORK COMPONENTS; ELECTRONICS PACKAGING;

UNDERFILL MATERIALS;

EID: 0031644367     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678679     Document Type: Conference Paper

References (5)

1. M. A. Chopra, "Fabrication Issues in the Development of Low Cost Flip Chip BGA Assemblies, " Surface Mount International, (1995), pp. 226-231.
2. D. Suryanarayana, R. Hsiao, T. P. Gall, J. M. McCreary, "Flip Chip Solder Bump Fatigue Enhanced by Polymer Encapsulation, " IEEE Trans-CPMT, Vol. 14, No. 1 (1991), pp. 218-223.
3. T. Y. Chua, T. N. Beng, L. T. Beng, T. G. Leong, N. Bhandarkar, K. Chakravorty, "BGA Package Analysis with FEA, " Semicon 95 Technical Symposium (3rd Annual Singapore Technical Conference on 2. Assembly, Packaging and IC Technology), (1995), pp. 108-117.
4. L. Nguyen, L. Hoang, P. Fine, Q. Tong, B. Ma, R. Humphreys, A. Savoca, C. P. Wong, S. Shi, M. Vincent, L. Wang, "High Performance Underfills Development-Materials, Processes, Reliability, " 1st IEEE Int. Symp. on Polymeric Electronics Packaging, NorrkOping, Sweden, October 26-30, (1997), pp. 300-306.
5. Y. Sha, C. Y. Hui, E. J. Kramer, "Underfill Delamination Trends in DCA Assemblies, " BGA/DCA Consortium-Advanced Technology, May 1996.