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IEEE Circuits and Devices Magazine

Volumn 18, Issue 4, 2002, Pages 40-49

Addressing packaging challenges

(5) Adam, Joseph a Chang, Chi Shih b Stankus, John J c Iyer, Mahadevan K d Chen, William T e

a Rockwell Semiconductor Systems (United States)

b Kulicke and Soffa (United States)

c NORTEL NETWORKS (United States)

d INSTITUTE OF MICROELECTRONICS (Singapore)

e ASE (US) Inc (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONCURRENT ENGINEERING; CONSUMER ELECTRONICS; FLIP CHIP DEVICES; MICROELECTROMECHANICAL DEVICES; OPTOELECTRONIC DEVICES; PRODUCT DEVELOPMENT; RESEARCH AND DEVELOPMENT MANAGEMENT; TECHNOLOGY TRANSFER;

INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS; PACKAGE DESIGN REQUIREMENTS; PACKAGE MATERIALS REQUIREMENTS; PACKAGE RELIABILITY; PACKAGING RESEARCH AND TECHNOLOGY DEVELOPMENT;

ELECTRONICS PACKAGING;

EID: 0036655195 PISSN: 87553996 EISSN: None Source Type: Journal
DOI: 10.1109/MCD.2002.1021121 Document Type: Article

Times cited : (10)

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