Copper wires for high speed logic LSI prepared by low pressure long throw sputtering method

Materials Transactions

Volumn 43, Issue 7, 2002, Pages 1599-1604

  Saito, Tatsuyuki ^a   Hashimoto, Takashi ^a   Ohashi, Naofumi ^a   Fujiwara, Tsuyoshi ^a   Yamaguchi, Hizuru ^a  

^a HITACHI LTD   (Japan)

Author keywords

Copper; Hydrogen; Interconnect; Large scale integrated circuit; Re flow; Reduction; Scattering; Sputtering; Step coverage

Indexed keywords

ANNEALING; COPPER; ELECTRIC CONDUCTIVITY; FABRICATION; HYDROGEN; LSI CIRCUITS; PRESSURE EFFECTS; SILICON WAFERS; SPUTTER DEPOSITION; SUBSTRATES;

COPPER INTERCONNECT SYSTEMS;

ELECTRIC WIRE;

EID: 0036630317     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1599     Document Type: Article

References (7)