Impact of low pressure long throw sputtering method on submicron copper metallization

Proceedings of the IEEE 1998 International Interconnect Technology Conference, IITC 1998

Volumn 1998-June, Issue , 1998, Pages 160-162

  Saito, T ^a   Ohashi, N ^a   Yasuda, J ^a   Noguchi, J ^a   Imai, T ^a   Sasajima, K ^a   Hiruma, K ^a   Yamaguchi, H ^a   Owada, N ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; METALLIZING;

COPPER METALLIZATION; CU INTERCONNECT; CU METALLIZATION; CU WIRING; LONG THROW SPUTTERING; LOW PRESSURES; REFLOW PROCESS; VIA FILLING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962785434     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1998.704779     Document Type: Conference Paper

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