SCOPUS 정보 검색 플랫폼

Volumn 149, Issue 6, 2002, Pages

Performance evaluation of cleaning solutions enhanced with tetraalkylammonium hydroxide substituents for post-CMP cleaning on poly-Si film

(7) Pan, Tung Ming a Lei, Tan Fu c Ko, Fu Hsiang b Chao, Tien Sheng b,c Liaw, Ming Chi c Lee, Ying Hao d Lud, Chih Peng d

a Department of Electronics Engineering

b NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

c NATIONAL NANO DEVICE LABORATORIES (Taiwan)

d Merck Kanto Advanced Chemicals Ltd (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; AMMONIUM COMPOUNDS; CAPACITORS; CHEMICAL MECHANICAL POLISHING; COMPOSITION EFFECTS; ELECTRIC PROPERTIES; ETCHING; HYDROPHILICITY; POLYSILICON; SURFACE ACTIVE AGENTS; SURFACE PHENOMENA; SURFACE ROUGHNESS;

AQUEOUS-PHASE SURFACE INTERACTIONS; CLEANING SOLUTIONS; DOUBLE LAYER FORMATION; POST CHEMICAL MECHANICAL POLISHING CLEANING; REMOVAL EFFICIENCIES; REMOVAL MECHANISMS; TETRAALKYLAMMONIUM HYDROXIDE;

SURFACE CLEANING;

EID: 0036607202 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1474435 Document Type: Article

Times cited : (14)

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