RCA clean replacement

Journal of the Electrochemical Society

Volumn 143, Issue 6, 1996, Pages 2064-2067

  Cady, W A ^a   Varadarajan, M ^b  

^a Mallinckrodt Baker Inc   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMMONIUM COMPOUNDS; CHARACTERIZATION; CMOS INTEGRATED CIRCUITS; ELECTRIC FIELD EFFECTS; HYDROCHLORIC ACID; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SPRAYING; SURFACE TREATMENT; THERMAL EFFECTS;

ALKALINE SOLUTION; AMMONIUM HYDROXIDE; CHEMICAL FLOW; CLEAN REPLACEMENT; ELECTRICAL STRESS BREAKDOWN; SPRAY RATE; SPRAY TIME; SPRAY TOOL; TUNNEL OXIDE; WATER RINSE;

SURFACE CLEANING;

EID: 0030167488     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836950     Document Type: Article

References (8)

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6. K. K. Christenson, S. M. Smith, and D Werho, ibid., 12(6), 47 (1994).
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