Novel cleaning solutions for polysilicon film post chemical mechanical polishing

IEEE Electron Device Letters

Volumn 21, Issue 7, 2000, Pages 338-340

  Pan, Tung Ming ^a   Lei, Tan Fu ^a   Chen, Chao Chyi ^c   Chao, Tien Sheng ^b   Liaw, Ming Chi ^b   Yang, Wen Lu ^c   Tsai, Ming Shih ^b   Lu, C P ^d   Chang, W H ^d  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^c FENG CHIA UNIVERSITY   (Taiwan)

^d Merck Kanto Advanced Chemicals Ltd   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACETIC ACID; AMMONIUM COMPOUNDS; CHEMICAL CLEANING; CHEMICAL MECHANICAL POLISHING; CONTAMINATION; ELECTRIC PROPERTIES; POLYSILICON; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE TESTING; SOLUTIONS;

CLEANING SOLUTIONS; DILUTED AMMONIUM HYDROXIDE; ETHYLENE DIAMINE TETRA ACETIC ACID; METALLIC CONTAMINATION; ORGANIC CONTAMINATION; POLYSILICON FILM; TETRAMETHYL AMMONIUM HYDROXIDE;

MICROELECTRONIC PROCESSING;

EID: 0034217259     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.847373     Document Type: Article

References (7)

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