Tensile testing system for sub-micrometer thick films

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 492-496

  Tsuchiya, Toshiyuki ^a,b   Shikida, Mitsuhiro ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

^b Rd Management Section   (Japan)

Author keywords

Electrostatic force grip; Single crystal silicon; Tensile test

Indexed keywords

ELASTIC MODULI; ELECTROSTATICS; FORCE MEASUREMENT; MECHANICAL VARIABLES MEASUREMENT; MICROMACHINING; SERVOMECHANISMS; SINGLE CRYSTALS; STIFFNESS; SUBSTRATES; TENSILE STRENGTH; TENSILE TESTING; THICK FILMS;

BULK MICROMACHINING; DIFFERENTIAL STIFFNESS METHOD; ELECTROSTATIC FORCE; ELECTROSTATIC FORCE GRIP SYSTEM; SERVO CONTROLLED BALANCE; SUBMICROMETER THICK FILMS; TENSILE TESTING SYSTEM;

SILICON WAFERS;

EID: 0036544383     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00862-7     Document Type: Conference Paper

References (6)

1. Measurement of mechanical properties of microfabricated thin films
2. Electrostatically actuated failure of micro-fabricated polysilicon fracture mechanics specimens
3. Tensile testing of silicon film having different crystallographic orientation carried out on a silicon chip
4. Specimen size effect on tensile strength of surface micromachined polycrystalline silicon thin films
5. 2 films
6. Calculated elastic constants for stress problems associated with semiconductor devices