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Volumn 22, Issue 4, 2000, Pages 51-52,-54
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Peroxide control in Cu/W CMP slurry
a
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Author keywords
[No Author keywords available]
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Indexed keywords
AUTOMATION;
CHEMICAL POLISHING;
COPPER;
DEGRADATION;
ERRORS;
HYDROGEN PEROXIDE;
PROCESS CONTROL;
PROGRAMMABLE LOGIC CONTROLLERS;
REGRESSION ANALYSIS;
SLURRIES;
STABILIZERS (AGENTS);
TUNGSTEN;
CERRIC AMMONIUM SULPHATE;
CHEMICAL MECHANICAL PLANARISATION;
OXIDATION REDUCTION TITRATION;
PRESSURE VACUUM DELIVERY SYSTEMS;
RELATIVE ERROR;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0033898176
PISSN: 02656027
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
Times cited : (3)
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References (0)
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