Electrochemical effects in the chemical-mechanical polishing of copper for integrated circuits

Journal of Electronic Materials

Volumn 25, Issue 10, 1996, Pages 1593-1598

  Sainio, C A ^a   Duquette, D J ^a   Steigerwald, J ^a,b   Murarka, S P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Chemical mechanical polishing; Copper; Linear polarization resistance

Indexed keywords

EID: 0000493157     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02655581     Document Type: Article

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