-
3
-
-
0027983273
-
Fracture properties of molding compound materials for IC plastic packaging
-
May
-
J. Sauber, L. Lee, S. Hsu, T. Hongsmatip, Fracture properties of molding compound materials for IC plastic packaging, Proc. 44th IEEE Electronic Components Technol. Conf., May 1994, pp. 164-170.
-
(1994)
Proc. 44th IEEE Electronic Components Technol. Conf.
, pp. 164-170
-
-
Sauber, J.1
Lee, L.2
Hsu, S.3
Hongsmatip, T.4
-
4
-
-
0029232757
-
Polyimide fatigue induced chip surface damage in DRAM's lead-on-chip (LOC) packages
-
April
-
M. Amagai, Polyimide fatigue induced chip surface damage in DRAM's lead-on-chip (LOC) packages, Proc. 33rd IEEE Int. Reliability Physics Symp., April 1995, pp. 97-106.
-
(1995)
Proc. 33rd IEEE Int. Reliability Physics Symp.
, pp. 97-106
-
-
Amagai, M.1
-
5
-
-
0347852525
-
Mechanics of Interface
-
February
-
R. Yuki, Mechanics of Interface, in: Book of the Baihukan, February 1993, pp. 1-283.
-
(1993)
Book of the Baihukan
, pp. 1-283
-
-
Yuki, R.1
-
6
-
-
0009030137
-
-
Report of Tokyo University, January
-
Miyoshi, Mechanics of interface, Report of Tokyo University, January 1992.
-
(1992)
Mechanics of Interface
-
-
Miyoshi1
-
8
-
-
33748876312
-
Development of a tapeless lead-on-chip (LOC) Package
-
Eng., ICD, November
-
M. Amagai, et al., Development of a tapeless lead-on-chip (LOC) Package, Proc. Inst. of Electronics, Information. and Communication, Eng., ICD, November 1994, pp. 81-88.
-
(1994)
Proc. Inst. of Electronics, Information. and Communication
, pp. 81-88
-
-
Amagai, M.1
-
9
-
-
0023750659
-
Volume production of unique plastic surface-mount modules for the IBM 80 ns 1 Mbit DRAM chip by area wire bond techniques
-
W.C. Ward, Volume production of unique plastic surface-mount modules for the IBM 80 ns 1 Mbit DRAM chip by area wire bond techniques, Proc. 38th IEEE Electronic Components Conf., 1989.
-
(1989)
Proc. 38th IEEE Electronic Components Conf.
-
-
Ward, W.C.1
-
10
-
-
0347222436
-
Lead on chip TSOP assembly process for fast SRAM with Peripherally Located Bond Pads
-
September
-
D. Hagen, et al., Lead on chip TSOP assembly process for fast SRAM with Peripherally Located Bond Pads, Proc. IEEE CHMT Int. Electronics Manuf. Technol. Symp., September 1992, pp. 39-47.
-
(1992)
Proc. IEEE CHMT Int. Electronics Manuf. Technol. Symp.
, pp. 39-47
-
-
Hagen, D.1
-
11
-
-
0027211680
-
Lead-on-chip technology for high performance packaging
-
M. Lamson, et al., Lead-on-chip technology for high performance packaging, Proc. IEEE Electronic Components Technol. Conf., 1993, pp. 1045-1050.
-
(1993)
Proc. IEEE Electronic Components Technol. Conf.
, pp. 1045-1050
-
-
Lamson, M.1
-
13
-
-
0029227308
-
The effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages
-
May
-
M. Amagai, The effect of adhesive surface chemistry and morphology on package cracking in tapeless lead-on-chip (LOC) packages, Proc. 45th IEEE Electronic Components Technol. Conf., May 1995, pp. 719-727.
-
(1995)
Proc. 45th IEEE Electronic Components Technol. Conf.
, pp. 719-727
-
-
Amagai, M.1
-
14
-
-
0028207904
-
The effect of polyimide surface morphology and chemistry on package cracking induced by interfacial delamination
-
April
-
M. Amagai, et al., The effect of polyimide surface morphology and chemistry on package cracking induced by interfacial delamination, Proc. 32nd IEEE Int. Reliability Physics Symp., April 1994, pp. 101-106.
-
(1994)
Proc. 32nd IEEE Int. Reliability Physics Symp.
, pp. 101-106
-
-
Amagai, M.1
-
16
-
-
0028698549
-
Chip surface damage induced by internal stress of Lead-on-chip (LOC) packages
-
M. Amagai, et al., Chip surface damage induced by internal stress of Lead-on-chip (LOC) packages, Proc. Mat. Res. Soc. Symp. 338 (1994), 185-193.
-
(1994)
Proc. Mat. Res. Soc. Symp.
, vol.338
, pp. 185-193
-
-
Amagai, M.1
-
18
-
-
0028738186
-
Temperature Cycles Induced Chip Surface Damage in Lead-On-Chip Packages
-
October
-
M. Amagai, Temperature Cycles Induced Chip Surface Damage in Lead-On-Chip Packages, Proc. Int. Soc. for Photo-Optical Eng., Microelectronics Manuf, Yield, and Reliability Symp., vol. 2334, October 1994, pp. 328-335.
-
(1994)
Proc. Int. Soc. for Photo-Optical Eng., Microelectronics Manuf, Yield, and Reliability Symp.
, vol.2334
, pp. 328-335
-
-
Amagai, M.1
-
19
-
-
0347222407
-
Computer simulation designs for lead-on-chip packages
-
November
-
M. Amagai, Computer simulation designs for lead-on-chip packages, Proc. 2nd IEEE VLSI Packaging Workshop of Japan, November 1994, pp. 105-108.
-
(1994)
Proc. 2nd IEEE VLSI Packaging Workshop of Japan
, pp. 105-108
-
-
Amagai, M.1
-
20
-
-
0346592467
-
Computer modeling for IC package
-
October
-
M. Amagai, Computer modeling for IC package, Proc. Ansys Japan Conf., October 1993, pp. 209-212.
-
(1993)
Proc. Ansys Japan Conf.
, pp. 209-212
-
-
Amagai, M.1
-
21
-
-
0347222408
-
Computer modeling for integrated circuit package
-
October
-
M. Amagai, Computer modeling for integrated circuit package, Proc. Ansys Japan Conf., October 1994, pp. 323-330.
-
(1994)
Proc. Ansys Japan Conf.
, pp. 323-330
-
-
Amagai, M.1
-
23
-
-
0347222409
-
Polyimide fatigue induced chip surface damage in DRAM's lead-on-chip (LOC) packages
-
October
-
M. Amagai, Polyimide fatigue induced chip surface damage in DRAM's lead-on-chip (LOC) packages, Proc. Ansys Japan Conf., October (1995).
-
(1995)
Proc. Ansys Japan Conf.
-
-
Amagai, M.1
-
25
-
-
0028096421
-
Cracking failure in lead-on-chip packages induced by chip backside contamination
-
May
-
M. Amagai, et al., Cracking failure in lead-on-chip packages induced by chip backside contamination, Proc. 44th IEEE Electronic Components Technol. Conf., May 1994, pp. 171-176.
-
(1994)
Proc. 44th IEEE Electronic Components Technol. Conf.
, pp. 171-176
-
-
Amagai, M.1
-
26
-
-
0347222402
-
Linear Fracture Mechanics
-
February
-
H. Okamura, Linear Fracture Mechanics, in: Book of the Baihukan, February 1989, pp. 1-222.
-
(1989)
Book of the Baihukan
, pp. 1-222
-
-
Okamura, H.1
-
28
-
-
0008986703
-
On the use of isoparametric finite elements in linear fracture mechanics
-
R.S. Barsoum, On the use of isoparametric finite elements in linear fracture mechanics, Int. J. Numer. Meth. Eng. 9 (1975) 495-509.
-
(1975)
Int. J. Numer. Meth. Eng.
, vol.9
, pp. 495-509
-
-
Barsoum, R.S.1
-
29
-
-
0009001011
-
Mechanics of the interface in LSI package
-
August
-
R. Yuuki, M. Sato, Mechanics of the interface in LSI package, Proc. Japan Soc. Mech. Eng., Int. Symp. on Highly Advanced Computing, August 1994, pp. 107-122.
-
(1994)
Proc. Japan Soc. Mech. Eng., Int. Symp. on Highly Advanced Computing
, pp. 107-122
-
-
Yuuki, R.1
Sato, M.2
-
30
-
-
0009030136
-
A Benchmark test of computational mechanics in electronic device and components
-
August
-
M. Shiratori, O. Yu, A Benchmark test of computational mechanics in electronic device and components, Proc. Japan Soc. of Mech. Eng., Int. Sym. on Highly Advanced Computing, August 1994, pp. 177-195.
-
(1994)
Proc. Japan Soc. of Mech. Eng., Int. Sym. on Highly Advanced Computing
, pp. 177-195
-
-
Shiratori, M.1
Yu, O.2
-
31
-
-
85008269051
-
Two edge bonded elastic wedges of different materials and wedge angles and surface tractions
-
D.B. Bogy, Two edge bonded elastic wedges of different materials and wedge angles and surface tractions, J. Appl. Mech. (1971) 377-386.
-
(1971)
J. Appl. Mech.
, pp. 377-386
-
-
Bogy, D.B.1
-
32
-
-
85123615747
-
Analysis of stresses and strains near the end of a crack traversing a plate
-
G. R, Irwin, Analysis of stresses and strains near the end of a crack traversing a plate, J. Appl. Mech. 24 (1957) 361-364.
-
(1957)
J. Appl. Mech.
, vol.24
, pp. 361-364
-
-
Irwin, G.R.1
-
33
-
-
85009578815
-
Problems of joint in packaging of electronics devices
-
M. Shiratori, Problems of joint in packaging of electronics devices, Japan Soc. Mech. Eng. 60 (1994) 3-10.
-
(1994)
Japan Soc. Mech. Eng.
, vol.60
, pp. 3-10
-
-
Shiratori, M.1
-
34
-
-
0347852501
-
Plastic fracture toughness
-
I. Narisawa, Plastic fracture toughness, in: Book of the Sigma, 1993, pp. 1-204.
-
(1993)
Book of the Sigma
, pp. 1-204
-
-
Narisawa, I.1
-
35
-
-
0028514445
-
Stress intensity factors for interface crack between dissimilar orthotropic materials
-
Jin Quan XU, R. Yuuki, Stress intensity factors for interface crack between dissimilar orthotropic materials, Japan Soc. Mech. Eng. 60 (1994) 41-48.
-
(1994)
Japan Soc. Mech. Eng.
, vol.60
, pp. 41-48
-
-
Xu, J.Q.1
Yuuki, R.2
-
36
-
-
0028194812
-
Simplified and practical estimation of package cracking during reflow soldering process
-
April
-
K. Sawada, T. Nakazawa, N. Kawamura, et al., Simplified and practical estimation of package cracking during reflow soldering process, Proc. 32nd IEEE Int. Reliability Physics Symp., April 1994, pp. 114-119.
-
(1994)
Proc. 32nd IEEE Int. Reliability Physics Symp.
, pp. 114-119
-
-
Sawada, K.1
Nakazawa, T.2
Kawamura, N.3
-
37
-
-
0027814190
-
Failure mechanism models for cyclic fatigue
-
A. Dasgupta, Failure mechanism models for cyclic fatigue, IEEE Trans. Reliability 42 (4) (1993) 548-555.
-
(1993)
IEEE Trans. Reliability
, vol.42
, Issue.4
, pp. 548-555
-
-
Dasgupta, A.1
-
39
-
-
0345961188
-
Fracture load estimation method for LSI ceramic packages using stress intensity factors
-
M. Ishibashi, Fracture load estimation method for LSI ceramic packages using stress intensity factors, J. SHM 11 (4) (1995).
-
(1995)
J. SHM
, vol.11
, Issue.4
-
-
Ishibashi, M.1
|