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Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 41, Issue 3 A, 2002, Pages 1500-1506

Adhesion characteristics between chemical vapor deposited Cu and TiN films: Aspects of process integration

(3) Kim, Young Suk a Hamamura, Hirotaka a Shimogaki, Yukihiro a

a UNIVERSITY OF TOKYO (Japan)

Author keywords

Adhesion; Copper MOCVD; Integration; Interface; Pull off test; TiN CVD; XPS

Indexed keywords

ADHESION; COPPER; CRYSTALLINE MATERIALS; DIFFUSION; INTERFACES (MATERIALS); METALLORGANIC CHEMICAL VAPOR DEPOSITION; MORPHOLOGY; TITANIUM NITRIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

PROCESS INTEGRATIONS;

THIN FILMS;

EID: 0036508590 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/jjap.41.1500 Document Type: Article

Times cited : (13)

References (17)

1
- 0035443322
- (2001) J. Vac. Sci. Technol. A , vol.19 , pp. 2642
- Kim, Y.S.¹ Shimogaki, Y.²

2
- 0026917213
- (1992) J. Electrochem Soc. , vol.139 , pp. 2580
- Buiting, M.J.¹ Otterloo, F.A.²

3
- 0030168444
- (1996) J. Electrochem. Soc. , vol.143 , pp. 2059
- Fiordalice, R.W.¹ Hegde, R.I.² Kawasaki, H.³

4
- 0026062794
- (1991) J. Electrochem. Soc. , vol.138 , pp. 190
- Yokoyama, N.¹ Hinode, K.² Homma, Y.³

5
- 0034275371
- (2000) J. Electrochem. Soc. , vol.147 , pp. 3377
- Juppo, M.¹ Ritala, M.² Leskela, M.³

6
- 0035270945
- (2001) Jpn. J. Appl. Phys. , vol.40 , pp. 1517
- Hamamura, H.¹ Komiyama, H.² Shimogaki, Y.³

7
- 84989005865
- eds. D. Briggs and M. P. Seah (Wiley, Chichester)
- (1983) Practical Surface Analysis by Auger and X-ray Photoelectron Spectroscopy , pp. 505
- Briggs, D.¹ Riviere, J.C.²

8
- 0032120235
- (1998) Surf. Interface Anal. , vol.26 , pp. 549
- McCafferty, E.¹ Wightman, J.P.²

9
- 25944453200
- (1981) Phys. Rev. B , vol.23 , pp. 4369
- Van der Lann, G.¹ Westra, C.² Hass, C.³ Sawatzky, G.A.⁴

10
- 0009712824
- (1990) J. Appl. Phys. , vol.67 , pp. 1055
- Yue, M.L.¹ Ahn, K.Y.² Joshi, R.V.³

11
- 0009704075
- eds. R. C, Ellwanger and S. Wang (Material Research Society, Pittsburgh, PA)
- (1997) Proc. Advanced Metallization and Interconnect Systems for ULSI Applications in 1997 , pp. 491
- Mashimo, K.¹ Inoue, K.² Hosoda, T.³ Ohba, T.⁴ Yoshida, M.⁵

12
- 0020129884
- (1982) Thin Solid Films , vol.91 , pp. 155
- Chamberlain, M.B.¹

13
- 0035894804
- (2001) Jpn. J. Appl. Phys. , vol.40
- Kim, Y.S.¹ Shimogaki, Y.²

14
- 0029541734
- (1995) Thin Solid Films , vol.270 , pp. 621
- Leutenecker, B.¹ Foschle, B.² Cao-Mihn, U.³ Ramm, P.⁴

15
- 0035300706
- (2001) Jpn. J. Appl. Phys. , vol.40 , pp. 2679
- Moriwaki, M.¹ Yamada, T.²

16
- 0003459529
- Perkin-Elmer, Eden Prairie, MN
- (1995) Handbook of X-ray Photoelectron Spectroscopy
- Chastain, J.¹ King R.C., Jr.²

17
- 0009681371
- (1995) JCPDS-International Center for Diffraction Data File , vol.4 , Issue.836

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