Recent developments in dimensional metrology for microsystem components

Microsystem Technologies

Volumn 8, Issue 1, 2002, Pages 3-6

  Cao, S ^a   Brand, U ^a   Kleine Besten, T ^a   Hoffmann, W ^a   Schwenke, H ^a   Butefisch S ^b   Buttgenbach S ^b  

^a PHYSIKALISCH TECHNISCHE BUNDESANSTALT   (Germany)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COORDINATE MEASURING MACHINES; MICROOPTICS; MICROSTRUCTURE; OPTICAL SENSORS; PIEZOELECTRIC TRANSDUCERS; SILICON;

MICROSYSTEM TECHNOLOGIES;

MICROELECTRONICS;

EID: 0036493917     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-001-0156-4     Document Type: Article

References (18)

1. Development of a special CMM for dimensional metrology on microsystem components
2. Design of a new error-corrected co-ordinate measuring machine
3. Silicon three-axial tactile sensor for micromaterial characterisation
4. Precision tracer tool for the measurement of the inner contour of blind holes
5. Opto-tactile sensor
6. Development and characterization of new probes for dimensional metrology on microsystem components
7. Miniaturisierter 3d-tastsensior für die metrologie an mikrostrukturen
8. 3D tactile Probe for dimensional metrology on microsystem components
9. Grating pitch measurements with the molecular measuring machine
10. Design for a compact high-accuracy CMM
11. Development of a 2D probing system with nanometer resolution
12. Opto-taktiler sensor zur 2d- und 3d-messung kleiner strukturen mit koordinatenmeßgeräten
13. Messkopf für mikrostrukturen
14. Development of ultra-precision 3D-CMM based on 3-D metrology frame
15. Design of a high-precision 3D-coordinate measuring machine
16. New design principles of the PRIMAR machine