Vibration maps of capacitive micromachined ultrasonic transducers by laser interferometry

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

Volumn 49, Issue 3, 2002, Pages 289-292

  Caronti, Alessandro ^b   Majjad, Hicham ^c   Ballandras, Sylvain ^c   Caliano, Giosuě ^a,b   Carotenuto, Riccardo ^b   Iula, Antonio ^a,b   Foglietti, Vittorio ^a,d   Pappalardo, Massimo ^a,b  

^a IEEE

^b ROMA TRE UNIVERSITY   (Italy)

^c CNRS   (France)

^d CNR   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; INTERFEROMETRY; LASER APPLICATIONS; MICROMACHINING; OPTICAL VARIABLES MEASUREMENT; ULTRASONIC IMAGING; VIBRATION MEASUREMENT;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS (CMUT); VIBRATION MAPS;

ULTRASONIC TRANSDUCERS;

BIOMATERIAL; OXIDE; POLYIMIDE RESIN; RESIN; SILICON DERIVATIVE; SILICON OXIDE;

ARTIFICIAL MEMBRANE; CHEMISTRY; ELECTRIC CAPACITANCE; EQUIPMENT; EQUIPMENT DESIGN; INSTRUMENTATION; INTERFEROMETRY; LASER; LETTER; MATERIALS TESTING; METHODOLOGY; MOTION; RADIOFREQUENCY RADIATION; REPRODUCIBILITY; SENSITIVITY AND SPECIFICITY; THREE DIMENSIONAL IMAGING; TRANSDUCER; ULTRASOUND; VIBRATION;

COATED MATERIALS, BIOCOMPATIBLE; ELECTRIC CAPACITANCE; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; IMAGING, THREE-DIMENSIONAL; INTERFEROMETRY; LASERS; MATERIALS TESTING; MEMBRANES, ARTIFICIAL; MOTION; OXIDES; RADIO WAVES; REPRODUCIBILITY OF RESULTS; RESINS, SYNTHETIC; SENSITIVITY AND SPECIFICITY; SILICON COMPOUNDS; TRANSDUCERS; ULTRASONICS; VIBRATION;

EID: 0036488953     PISSN: 08853010     EISSN: None     Source Type: Journal    
DOI: 10.1109/58.990937     Document Type: Article

References (6)

1. Fabrication and characterization of surface micromachined capacitive ultrasonic immersion transducers
2. Simulation and experimental characterization of a 2-D capacitive micromachined ultrasonic transducer array element
3. Surface micromachined ultrasound transducers in CMOS technology
4. Micromachined ultrasound transducers with improved coupling factors from a CMOS compatible process
5. Capacitive ultrasonic transducers fabricated by a low temperature surface-micromachining process
6. An accurate model for capacitive micromachined ultrasonic transducers