Ultrasonic bonding: Understanding how process parameters determine the strength of Au-Al bonds

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 626-631

  Mayer, Michael ^a   Schwizer, Jürg ^b  

^a Oerlikon Assembly Equipment AG   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); CMOS INTEGRATED CIRCUITS; FRICTION; GOLD ALLOYS; INTERFACES (MATERIALS); MICROELECTRONIC PROCESSING; MICROPROCESSOR CHIPS; MICROSENSORS; SHEAR STRESS; YIELD STRESS;

FRICTION ENERGY; FRICTION POWER; PROCESS PARAMETERS; ULTRASONIC BONDING; ULTRASONIC FREQUENCY; WIRE BONDING;

BONDING;

EID: 0036450219     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

1. M. Mayer, O. Paul, and H. Baltes, "In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors", Proc. 2nd Int. Conf. Emerging Microelectr. and Interconn. Technol. EMIT'98, IMAPS, Bangalore, India, pp. 129-133, 1998.
2. M. Mayer, O. Paul, D. Bolliger, and H. Baltes, "In-Situ Calibration of Wire Bonder Ultrasonic System using Integrated Microsensor", Proc. 2nd IEEE Electr. Packaging Technol. Conf. EPTC'98, Singapore, pp. 219-223, 1998.
3. M. Mayer, O. Paul, D. Bolliger, and H. Baltes, "Integrated Temperature Microsensors for Characterization and Optimization of Thermosonic Ball Bonding Process", IEEE Trans. Comp. Packaging Technol., vol. 23, no. 2, pp. 393-398, 2000.
4. M. Mayer, J. Schwizer, O. Paul, D. Bolliger, and H. Baltes, "In-Situ Ultrasonic Stress Measurements During Ball Bonding using Integrated Piozoresistive Microsensors," Proc. 1999 Intersociety Electron. Pack. Conf. (InterPACK99), Maui, Hawaii, pp. 973-978, 1999.
5. M. Hizukuri and T. Asano, "Measurement of Dynamic Strain during Ultrasonic Au Bump Formation on Si Chip", Jpn. J. Appl. Phys., vol. 39, pp. 2478-2482, 2000.
6. M. Hizukuri, Y. Wada, N. Watanabe, and T. Asano, "Real Time Measurements of the Strain Generated on Substrate during Ultrasonic Flip Chip Bonding", 6th Symp. Micro-joining and Assembly Technol. in Electronics 2000, Yokohama, pp. 169-174, 2000.
7. J. Schwizer, M. Mayer, D. Bolliger, O. Paul, and H. Baltes, "Thermosonic Ball Bonding: Friction Model Based on Integrated Microsensor Measurements", Proc. 24th IEEE/CPMT Intl. Electronic Manufacturing Technology Symposium IEMT'99, Austin, Texas, Oct. 18-19, pp. 108-114, 1999.
8. J. Schwizer, M. Mayer, O. Brand, and H. Baltes, "Analysis of Ultrasonic Wire Bonding by In-situ Piezoresistive Microsensors", Proc. Transducers '01 / Eurosensors XV, pp. 1426-1429, 2001.
9. J. Schwizer, M. Mayer, O. Brand, and H. Baltes, "In situ Ultrasonic Stress Microsensor for Second Bond Characterization", Proc. Intl. Symp. Microelectronics IMAPS 2001, pp. 338-343, 2001.
10. S. Suman, M. Gaitan, Y. Joshi, G. Harman, "Wire Bond Temperature Sensor", Proc. Intl. Symp. Microelectronics IMAPS 2001, pp. 344-349, 2001.
11. M. Mayer and J. Schwizer, "Wire Bonder Ultrasonic System Calibration Using Integrated Stress Sensor", Proc. SEMI Technical Symposium, Advanced Packaging Technologies II, SEMI Singapore, pp. 169-175, 2002.
12. J. Schwizer, Q. Füglistaller, M. Mayer, Michael Althaus, O. Brand, and H. Baltes, "MEMS System with Multiplexer for In Situ and Real-time Wire Bonding Diagnosis", Proc. SEMI Technical Symposium, Advanced Packaging Technologies I, SEMI Singapore, pp. 163-167, 2002.
13. M. Mayer, Microelectronic Bonding Process Monitoring by Integrated Sensors, Ph.D. thesis, No. 13685, ETH Zurich, Zurich, 2000; also: Hartung-Gorre, Konstanz, Germany, ISBN 3-89649-620-4, 2000.
14. http://www.matweb.com