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Volumn 4426, Issue , 2002, Pages 437-440

Laser ablation patterning of dielectric layer stacks for 193 nm mask fabrication

Author keywords

Ablation; Dielectric layer; HfO2; Mask fabrication; SiOx

Indexed keywords

ALUMINA; DIELECTRIC MATERIALS; FUSED SILICA; HEAT TREATMENT; LIGHT ABSORPTION; MASKS;

EID: 0036387553     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.456875     Document Type: Article
Times cited : (13)

References (15)
  • 2
    • 0010140454 scopus 로고
    • Excimer laser projector for materials processing applications
    • E. Fogarassy, S. Lazare (Editors), Elsevier
    • M.C. Gower, P.T. Rumsby: Excimer laser projector for materials processing applications, in: Laser ablation of electronic materials, E. Fogarassy, S. Lazare (Editors), Elsevier 1992, p. 255.
    • (1992) Laser ablation of electronic materials , pp. 255
    • Gower, M.C.1    Rumsby, P.T.2
  • 7
    • 84994832608 scopus 로고    scopus 로고
    • Patent application DE 10017614.3
    • Patent application DE 10017614.3.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.