Materials issues in the application of silicon nitride films in silicon MEMS

Materials Research Society Symposium - Proceedings

Volumn 687, Issue , 2002, Pages 257-264

  Moore, David F ^a   Bostock, Roger M ^a   Boyle, Paul ^a   Conradie, Ewan H ^a  

^a UNIVERSITY OF CAMBRIDGE   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; ELECTRONICS PACKAGING; HIGH TEMPERATURE PROPERTIES; MECHANICAL VARIABLES CONTROL; MICROMACHINING; PHOTOLITHOGRAPHY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTIVE ION ETCHING; SILICON NITRIDE; THIN FILMS;

ANISOTROPIC LIQUID ETCH PROCESS; LOW TEMPERATURE PROCESSING; MICROASSEMBLY; THIN FILM PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 0036352279     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)