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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 183-191

In-situ moire interferometry technique and its applications to microelectronic packages

(2) Shi, X Q a Wang, Z P a

a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FRACTURE; INTERFEROMETRY; LOADING; MOIRE FRINGES; MOISTURE; THERMAL CYCLING;

MICROELECTRONIC PACKAGES;

MICROELECTRONICS;

EID: 0036292612 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (7)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.