Reliability assessment of a CSP assembly using a highly accelerated mechanical-thermal method

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 1315-1320

  Yang, Q J ^a   Shi, X Q ^a   Wang, Z P ^a   Shi, Z F ^a   Pang, H L J ^b   Lim, G H ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED THERMAL CYCLING (ATC); RELIABILITY TESTING;

ACCELERATION; CERAMIC MATERIALS; COMPUTER SIMULATION; COOLING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; HEATING; INPUT OUTPUT PROGRAMS; LOADING; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; STRAIN; STRESS ANALYSIS; THERMAL CYCLING;

CHIP SCALE PACKAGES;

EID: 0348198996     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Pang H. L.J, Ang K. H., Wang Z. P. and Shi X. Q., "Reliability Test Methodology using Thermo-Mechanical Deflection", ASME EEP-Vol 26-2, Advances in Electronic Packaging, 1999, pp.2077-2082
2. Wang Z. P., Tan Y. M., Chua K. M., Norstrom A., Xie D. J. and Shi Z. F., Final Report of Chip Scale Packages (CSPs) Consortium, Gintic Institute of Manufacturing Technology, 19 April, 1998.
3. Shi X.Q., Pang H. L. J., Zhou W. and Wang Z. P., "Effects of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy", Trans ASME, Journal of Electronic Packaging, Vol. 121, No. 3, September 1999, pp. 179-186.
4. Shi X. Q., Yang Q. J., Z. P. Wang, Pang H. L. J. and Zhou W., "Reliability Assessment of PBGA Solder Joints Using the New Creep Constitutive Relationship and Modified Energy-Based Life Prediction Model", Proceedings of 3rd Electronics Packaging Technology Conference, Dec. 2000, Singapore, pp.398-405.
5. Shi X. Q., Pang H.L. J., Zhou W. and Wang Z. P., "A Modified Energy-Based Low Cycle Fatigue Model for Eutectic Solder Alloy", Scripta Materialia, Vol. 41, pp. 289-296, 1999.
6. Darveaux R., Mawer A., "Thermal and Power Cycling Limits of Plastic Ball Grid Array (PBGA) Assemblies," SMT Conference Proceedings, August 1995, pp. 315-326.
7. Syed A. R., "Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages", Proceeding of Electronic Components and Technology Conference, 1996, pp. 1211-1216.