The evaluation of copper migration during the die attach curing and second wire bonding process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1586-1594

  Lin, T Y ^a   Davison, K L ^a   Leong, W S ^a   Chua, Simon ^a   Pan, J S ^b   Chai, J W ^b   Toh, K C ^b   Tjiu, W C ^b  

^a Agere Systems Singapore Pte Ltd   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER MIGRATION; WIRE BONDING;

ANNEALING; BONDING; COPPER; CRYSTAL MICROSTRUCTURE; ETCHING; HEAT TREATMENT; OXIDATION; SILVER PLATING; SURFACE ROUGHNESS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036287819     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008319     Document Type: Article

References (12)

1. The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy (XPS) method
2. Root cause analysis of non-stick on lead (NSOL) and verification of TQFP176 etched leadframe
3. The oxidation control of copper leadframe package for prevention of popcorn cracking
4. Oxide adhesion characteristic of lead frame copper alloys
5. An investigation on the plasma treatment of integrated circuit bond pads
6. Characterizing integrated circuit bond pads
7. Reliability effects of fluorine contamination of aluminum bonding pads on semiconductor chips
8. Bondability of silver plating on IC leadframe
9. Reliability study of wire bonds to silver plating surfaces
10. XPS study of incident angle effects on ion-beam modification of InP surfaces by 6 kev 02+
11. AES and XPS analysis of angle of incidence effects of ion-beam-induced nitridation of GaAs