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Volumn 4690 II, Issue , 2002, Pages 741-753

Methods for comparing contact hole shrinking techniques with 248 nm single layer and bilayer photoresists

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; DATA REDUCTION; PHOTOLITHOGRAPHY; SURFACE ROUGHNESS;

EID: 0036029159     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.474275     Document Type: Conference Paper
Times cited : (8)

References (7)
  • 3
    • 17344380149 scopus 로고    scopus 로고
    • 0.1 μm level contact hole pattern formation with KrF lithography by Resolution Enhancement Lithography Assisted by Chemical Shrink (RELACS)
    • T. Toyoshima, T. Ishibashi, A. Minanide, K. Sugino, K. Katayama, T. Shoya, I. Arimoto, N. Yasuda, H. Adachi, Y. Matsui, "0.1μm Level Contact Hole Pattern Formation with KrF Lithography by Resolution Enhancement Lithography Assisted by Chemical Shrink (RELACS)," IEDM, pages 333 - 336 (1998).
    • (1998) IEDM , pp. 333-336
    • Toyoshima, T.1    Ishibashi, T.2    Minanide, A.3    Sugino, K.4    Katayama, K.5    Shoya, T.6    Arimoto, I.7    Yasuda, N.8    Adachi, H.9    Matsui, Y.10
  • 4
    • 19644379107 scopus 로고    scopus 로고
    • Implementation of sub-150 nm contact hole pattern by resist flow process
    • J. Kim, C. Choi, M. Kim, C. Bok, H. Kim, K. Baik, "Implementation of Sub-150 nm Contact Hole Pattern by Resist Flow Process," Journal of Applied Physics 37, pages 6863 - 6868 (1998).
    • (1998) Journal of Applied Physics , vol.37 , pp. 6863-6868
    • Kim, J.1    Choi, C.2    Kim, M.3    Bok, C.4    Kim, H.5    Baik, K.6
  • 5
    • 0033706992 scopus 로고    scopus 로고
    • Contact hole size reducing methods by using Water-Soluble Organic Over-coating material (WASOOM) as a barrier layer toward 0.15 μm: Resist flow technique I
    • J. Chun, S. Bakshi, S. Barnett, J. Shih, S.K. Lee, "Contact Hole Size Reducing Methods by using Water-Soluble Organic Over-coating material (WASOOM) as a barrier layer toward 0.15 μm: Resist flow Technique I," SPIE 3999, pages 620 - 626 (2000).
    • (2000) SPIE , vol.3999 , pp. 620-626
    • Chun, J.1    Bakshi, S.2    Barnett, S.3    Shih, J.4    Lee, S.K.5
  • 6
    • 0033691964 scopus 로고    scopus 로고
    • Improvement in resist profile roughness in bi-layer resist process
    • C. Jeong, S. Ryu, K. Park, W. Lee, S. Lee, D. Lee, "Improvement in Resist Profile Roughness in Bi-Layer Resist Process," SPIE 3999, pages 818 - 826 (2000).
    • (2000) SPIE , vol.3999 , pp. 818-826
    • Jeong, C.1    Ryu, S.2    Park, K.3    Lee, W.4    Lee, S.5    Lee, D.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.