Contact hole size reducing methods by using water-soluble organic over-coating material (WASOOM) as a barrier layer toward 0.15 um contact hole; Resist flow technique I

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3999, Issue , 2000, Pages

  Chun, Jun Sung ^a   Bakshi, Shekhar ^a   Barnett, Stan ^a   Shih, James ^a   Lee, S K ^a  

^a INTEGRATED DEVICE TECHNOLOGY INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MASKS; PROTECTIVE COATINGS; THERMAL STRESS;

CONTACT HOLES; WATER-SOLUBLE ORGANIC OVERCOATING MATERIALS (WASOOM);

PHOTORESISTS;

EID: 0033706992     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)