Taper etching of copper using an inductively coupled O2 plasma and hexafluoroacetylacetone

Journal of the Korean Physical Society

Volumn 40, Issue 1, 2002, Pages 152-155

  Lee, W H ^a,d   Yang, H J ^a   Kim, J Y ^a   Lee, J C ^a   Lee, C M ^b   Kim, Y G ^c  

^a Kookmin University   (South Korea)

^b Inha University   (South Korea)

^c Korea Gas Corporation   (South Korea)

^d Sejong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0036002410     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (12)

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