Influence of surface cleanness on ultrasonic ball bondability of Au wire onto Au, Cu and Al pads: Study of ultrasonic bonding with surface cleaning by ion bombardment (report 2)

Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society

Volumn 16, Issue 1, 1998, Pages 93-104

  Kajiwara, Ryoichi ^a   Takahashi, Toshiyuki ^a   Tsubosaki, Kunihiro ^a   Watanabe, Hiroshi ^a  

^a HITACHI LTD   (Japan)

Author keywords

Al pad; Au pad; Au wire; Cu pad; Influence of surface cleanness on bondability; Ion bombardment; Surface cleaning; Ultrasonic ball bonding

Indexed keywords

ALUMINUM; AUGER ELECTRON SPECTROSCOPY; COPPER; GOLD; ION BOMBARDMENT; LOW TEMPERATURE OPERATIONS; METALLIC FILMS; SILICON WAFERS; ULTRASONIC CLEANING;

ULTRASONIC BALL BONDABILITY;

BONDING;

EID: 0032001441     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.16.93     Document Type: Article

References (8)

1. Y. Kashiba, K. Machida, T. Okuda, W. Shimada and S. Nakata : Energy-Free Bonding of Materials with Fine Controlled Surfacesin Ultrahigh Vacuum, Mat. Res. Soc. Symp. Proc., Vol. 108 (1988), 371-376.
2. T. Suga, T. Fujiwaka, G. Sasaki : Surface Activated Bonding and Its Application on Micro-Bonding at Room Temperature, Proc. 9th Euro. Hybrid Microelectron. Conf., (1993), 314-321.
3. Buckles S.L.: Use of Argon Plasma for Cleaning Hybrid Circuits Prior to Wire Bonding, Proc. 5th Int. Microelectron. Conf., (1988), 383-387.
4. H. Haji, T. Morita, K. Arita, H. Nakashima and H. Yoshinaga: Bondability of Gold Wire to Gold-Plated Electrodes, Materi. Trans., JIM, Vol. 34, No. 10, (1993), 960-965.
5. C.R. Brundle : The application of electron spectroscopy to surface studies, J. Vac. Sci. Tschol., Vol. 11, No. 1, (1974), 212-224.