Adhesion mechanism of electroless copper film formed on ceramic substrates using ZnO thin film as an intermediate layer

Journal of the Electrochemical Society

Volumn 145, Issue 5, 1998, Pages 1430-1434

  Yoshiki, Hajime ^a   Hashimoto, Kazuhito ^a   Fujishima, Akira ^a,b  

^a UNIVERSITY OF TOKYO   (Japan)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CATALYSIS; CERAMIC MATERIALS; CHEMICAL BONDS; COPPER; ELECTROLESS PLATING; PYROLYSIS; SUBSTRATES; THERMAL DIFFUSION IN SOLIDS; THIN FILMS; VAN DER WAALS FORCES; ZINC OXIDE;

PULL STRENGTH; SPRAY PYROLYSIS;

METALLIC FILMS;

EID: 0032070001     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838500     Document Type: Article

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