Electroless plating: The past is prologue

Plating and Surface Finishing

Volumn 83, Issue 9, 1996, Pages 29-33

  Hajdu, Juan ^a,b  

^a Enthone Inc   (United States)

^b UNIVERSIDAD DE BUENOS AIRES   (Argentina)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001824386     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

1. Electroless Plating, G.O. Mallory and J. Hajdu, Eds., AESF, Orlando, FL, 1990.
2. L. Wing and G. Evans, Proc. SAE International Congress (March 1993).
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4. J. Hajdu et al., Proc. Electrochem. Soc., PV 90-8, 685 (1990).
5. G. Kline et al., Proc. Electrochem. Soc., PV 93-26, 224 (1993).
6. B.G. Mottahed and S. Manoochehri, Polym. Plast. Technol. Engng., 34(3), 271 (1995).
7. W. Immel and J. Hajdu, Metalloberfläche, 47(4), 180 (1993).
8. L. Flögel, Galvanotechnik, 86, 657 (1995).
9. H. Akehoshi et al., IEEE Trans. on Components, Packaging and Mfg. Technol., Part A, 18(1), 127 (March 1995).
10. Y. Tsukada and S. Tsuchida, SM1 Proceedings (Sept. 1992).
11. T. Murakami, U.S. patent 5,092,032 (1992).
12. C. Mak, MRS Bulletin, 55 (Aug. 1994).
13. H. Homma et al., J. Electrochem Soc., 141(7), 1791 (1994).