Si based multi-layered print circuit board for MEMS packaging fabricated by Si deep etching, bonding and vacuum metal casting

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4592, Issue , 2001, Pages 473-480

  Murakoshi, Yoichi ^a   Hanada, Kotaro ^a   Li, Yaomin ^a   Uchino, Kazuyoshi ^a   Suzuki, Takaaki ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Deep Reactive Etching; Electrical feed through; Fusion bonding; Through Hole; Vacuum metal casting

Indexed keywords

BONDING; ELECTRONICS PACKAGING; INDUCTIVELY COUPLED PLASMA; METAL CASTING; MICROMACHINING; PLASMA ETCHING; PRINTED CIRCUIT BOARDS; SILICON WAFERS; VACUUM APPLICATIONS;

VACUUM METAL CASTING;

MICROELECTROMECHANICAL DEVICES;

EID: 0035773447     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.449004     Document Type: Conference Paper

References (5)

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2. Ryutaro Maeda, Yoichi Murakoshi, Toru Shimizu, Yaomin Li and Hiroyuki Takizawa, "Si based print circuit board fabricated by Si deep etching and Metal powder injection Molding, Smart materials and MEMS 2000, Proceedings of SPIE 4235(2000), to be published.
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